a. Resin Series
(Maximize cutting efficiency; Processing object: quartz, glass and other brittle materials)

b. Metal Series
(Extremely high wear resistance, suitable for the precision cutting and grooving of electronic components and optical elements)

c. Auxiliary Processing Tools for Electronic Industry
aa. Grinding Wheel for LED Substrate Thinning
(LED substrate thinning with superior grinding performance and high stability)
bb. Porous Ceramic Tables
(Porous ceramic tables are used for wafer supporting and chucking in the process of thinning and cutting.)